PROCESS FOR ELECTRICAL MANUFACTURING

 

SSIE-578

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FINAL

 

PRUTHAK AMITKUMAR PATEL

 

                                                                         

Part 1: Briefly outline what it is about manufacturing
that makes electronics so affordable today

·       
Reduction
in assembly cost, due to advent of new automated technologies that made design
manufacturing less complicated

·       
Thanks
to surface mount technology which reduced the through put technology, resulting
in reduced board size and cost, automation made easy

·       
Due
to high volume manufacturing, with less input, more number of units can be
produced thus increasing the economies of scale

·       
Due
to automated manufacturing there is consistency in the quality and productivity,
which leads to low operation variability, and thus less efforts and resources required
to do so at rework station

·       
Automated
Manufacturing reduced yield that is less defects at the end of assembly line,
which leads to less waste and thus increasing the manufacturing efficiency

 

Part 2:  Outline 3D
assembly (stacking) of chips and the CHIPS (Iyer, UCLA) concept

 

         
i.           
UCLA:

·       
A
large chip is formed using small chips, it uses the similar concept of LEGO
where small pieces are such joined together that they end up forming large
object, similarly the care that needs to be taken here is the dimensions of all
the small chips should be precise that needs to be interconnected, the chips
can be placed on the bed of silicon

       
ii.           
3D stacking of chips:

·       
Here
chips are placed one above the other to form multiple layer, these chips are
connected to each other through silicon vias, though there will be multiple
layers the area covered by these chips will be relatively less and thus saves
up huge space

·       
Solder
volume is reduced as there is increase in joints but subsequent decrease in
interconnects which then leads to decrease in scattered signal

·       
Chips
with different set of functions can also be stacked together, it requires precise tolerance and process control to do so

·       
Reliability
of stacking of chips can also be improved through underfill, since there is not
enough space left between the dies after packaging, sequential underfill is the
only option left

·       
Reduction
in number of dies thrown due to yield can put a great low cost on final product

·       
Increase
in the micro-bumps between the chips can enhance thermal conductivity

·       
Since
the distance between the chip is now reduced, it reduces the overall power
consumption and hence improves product efficiency

·       
Number
of layer that can be formed depends on the heat dissipation rate of each chip

Part 3.  Where
are the main challenges?

·       
Yield
loss in wafer to wafer can be high,

·       
 all die should be of same size

·       
Alignment
of the chips in each of the three types is critical

·       
3D
printing has lower thermal design power than any other type of printing

·       
Cost
and precision require to manufacture in the concept of CHIPS is considerably
large

Part 4. Will either of these approaches ever be part of
high volume electronics products?

·       
3D
printing may not become the part of high volume manufacturing since all the
parts cannot be made through it (for e.g. car parts which involves complex design
and structure) and even if it does it will take considerably long time to do
with the existing technology, unless we develop something that can instantly
make 3D objects like the one shown in terminator, 3D printing has still got long
road to cover.

·       
No,
this too is not possible to have high volume manufacturing, since manufacturing
processes can be different for different chips it is very difficult to manufacture
all chips with the accurate dimension and defect in one chip can cause problem
to the all the chips and hence with the existing research and knowledge we should
try to do it with the small scale

 

Part 5. Discuss where/how and to which extent (when)
each of these fit in

·       
3D
printing can be used for precise formation of any object

·       
It
can be used for small scale purposes, as in high volume it involves much larger
technology and care, which then go on increasing the cost of final product

·       
In
the running process it will be difficult to find which chip is not communicating
and hence it should be only used for small purposes

 

References:

1.    
http://www.referenceforbusiness.com/small/A-Bo/Automation.html

2.    
http://www.surfacemountprocess.com/

3.    
http://info.zentech.com/blog/bid/246390/The-Difference-Between-Through-Hole-And-Surface-Mounted-Technology

4.    
https://en.wikipedia.org/wiki/Economies_of_scale

5.    
https://www.smartsheet.com/guide-to-lean-project-management

6.    

Advantages and Disadvantages of Automation in Manufacturing

7.    
https://www.cmtc.com/blog/reduce-labor-costs-in-manufacturing

8.    
https://windowanddoor.com/article/feature-article/how-improve-manufacturing-efficiencies

9.    

The future of computers: 3D chip stacking

10.https://mycourses.binghamton.edu/bbcswebdav/pid-383717-dt-content-rid-904213_1/courses/GC201790/3D%20assembly.pdf

11.https://s3-us-west-1.amazonaws.com/chips.user.media/pres/WMED-2016-iyer-Boise.WM.pdf

12.http://newsroom.ucla.edu/releases/ucla-engineers-develop-the-first-electromagnetic-wave-routing-device-with-unlimited-bandwidth 

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